Micron New York mega fab faces environmental test

Micron New York mega fab faces environmental test

HomeNews, Other ContentMicron New York mega fab faces environmental test

Micron's proposed "mega fab" semiconductor plant in upstate New York is to be reviewed by the US Army Corps of Engineers (USACE), which is tasked with preparing an Environmental Impact Statement (EIS) for the project.

What will Micron Technology's megacomputer chip look like in downtown New York?

The memory chipmaker said in 2022 it would invest $100 billion over a 20-year period at a manufacturing facility to be located near the Onondaga County town of Clay, representing the largest chip manufacturing facility in US history.

Now, the US Army Corps of Engineers, Buffalo District, has received an application for a Department of the Army (DA) permit from Micron to build its DRAM chip manufacturing facility because the agency has determined that the proposed project could affect the local environment.

Additionally, Micron has applied to the National Institute of Standards and Technology (NIST) for funding to support this project as part of Washington's CHIPS and Science Act program, and this requires an environmental review under the National Environmental Policy Act (NEPA).

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Micron New York mega fab faces environmental test.
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