Ahead of Snapdragon Summit 2023, Qualcomm has introduced the new S3 Gen 2 Sound Platform. The new audio platform is meant to work with the upcoming flagship Snapdragon 8 Gen 3 chipset and offers a number of audio-focused features such as ultra-low latency of 20ms to name a few. Keep reading to know more about the latest Qualcomm chipset.
For fast-paced gaming experience here is S3 Gen 2 audio platform support below 20 millisecond latency
The S3 Gen 2 sound chip comes with Snapdragon Sound technology for an "audiophile quality" music streaming experience. It's intended for dongles and adapters to convert TVs, laptops, and more into "broadcast platforms." The chipset can deliver lossless audio up to 48KHz, offer better connectivity and much more.
Ideal for gaming, the chipset supports ultra-low latency of 20ms with support for Bluetooth LE Audio specification (Bluetooth version 4.0 ready). This makes the S3 Gen 2 compatible with Bluetooth Low Energy, Bluetooth Classic, Dual-mode Bluetooth and Google Fast Pair. The chipset has a 3-microphone Qualcomm cVc array with aptX Adaptive Audio and external SRAM for improved sound quality during games, calls and audio sessions.
On the technical front, you should know that the new audio platform is manufactured using a 32-bit manufacturing process with up to 80 MHz clock speed and a programmable CPU. The architecture offers built-in ROM+RAM and external Q-SPI Flash for the chipset with on-chip memory for audio buffering. It contains Qualcomm Kalimba configurable DSP with 240 MHz clock speed, 1024 KB data RAM and 384 KB program RAM.
