TSMC and partners will break ground in Dresden, Germany, to begin building the Taiwanese chipmaker's first European factory.
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The groundbreaking ceremony will take place on August 20 and will feature TSMC chairman and CEO CC Wei, amazing customers and government officials, the company confirmed to The Register.
"TSMC plans to hold the groundbreaking ceremony for ESMC's factory in Dresden, Germany, on August 20," TSMC said in a statement. "This event represents a significant milestone for TSMC and our investment partners in the European semiconductor industry. The ESMC project is on track as planned, with construction expected to begin in late 2024."
Despite the creative title ESMC (European Semiconductor Manufacturing Company), the plant is actually a collaboration between TSMC and three European processor companies: NXP, Infineon and Bosch. Each partner owns 10 percent of the project and contributed half a billion euros to finance the factory's budget of 10 billion euros.
