The major disadvantage of parallel circuits as compared to series circuits is that the power remains at the same voltage as the voltage of a single power source. Other disadvantages include the split of an energy source across the entire circuit, and lower resistance.

The current in a series circuit depends upon the number of cells. If you make the cells face in the same direction, the more cells you add, the greater the current.

In a series circuit, you can measure voltage using a voltmeter, which should be connected parallel to the component. This ensures that the reading is accurate since the voltage shared among the components in a series circuit is equal to the voltage supplied.

An electronic circuit is composed of individual electronic components, such as resistors, transistors, capacitors, inductors and diodes, connected by conductive wires or traces through which electric current can flow.

Glass, paper and resin are all very good insulators. The contacts of the chip holder are gold plated. This gives an excellent low resistance contact and also prevents tarnishing (oxidisation), which would otherwise increase the contact resistance over time.

FR4 is rightly the most used material in PCB construction. Boards made from FR4 are strong, water resistant, and provide good insulation between copper layers that minimizes interference and supports good signal integrity.

FR-4 (or FR4) is a NEMA grade designation for glass-reinforced epoxy laminate material. FR-4 is a composite material composed of woven fiberglass cloth with an epoxy resin binder that is flame resistant (self-extinguishing). G-10, the predecessor to FR-4, lacks FR-4’s self-extinguishing flammability characteristics.

Printed circuit boards (PCBs) are usually a flat laminated composite made from non-conductive substrate materials with layers of copper circuitry buried internally or on the external surfaces. They can be as simple as one or two layers of copper, or in high density applications they can have fifty layers or more.

FR4 is a code name for the grade of Epoxy Glass material. Tg means Glass Transition Temperature. When the working temperature reaches the melting point, that means the temperature exceeds the Tg value, the status of PCB material will be changed from glassy to liquid, which will affect the function of PCB.

Tg or Glass transition temperature, is the base material parameter for the temperature (°C). It defines at what temperature the base material becomes mechanically unstable. Tg is the temperature value that guarantees the mechanical stability of the PCB during operational life time of the PCB.

The main difference between NEMA Grades G10 and FR4 is that FR4 is a fire retardant grade of G10. Therefore, FR4 can be safely substituted where G10 is called for, while G10 can never be substituted where FR4 is called for. G10 meets MIL-I-24768/2 GEE and FR4 meets MIL-I-24768/27 GEE-F.

When it comes to material for PCBs, high Tg should be picked, which should be higher than the working temperature current runs. As the temperature of substance rises, substance will suffer from expansion or shrinking.

Medium Tg PCBs generally have a maximum temperature of above 150°C while high Tg PCBs are rated above 170°C. PCBs with higher Tg value also demonstrate better moisture and chemical resistance, as well as sturdier physical structure in heat.

While evaluating PCB Board materials, it is necessary to ensure that design requirements align with desired board capabilities. Spacing and width of a board are also important, when it is required to handle high amounts of current. Structural strength of the board is defined by substrate and laminate.